99re8热视频这在线视频

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          Multi - layer circuit board cutting machine information
          Multi - layer circuit board cutting machine information

          In 1961, the United States Hazelting Corp. announced that Multiplanar, is the first to open the development of multi-layer board precursor, this approach and now using plating through the hole to create multi-layer approach is almost the same. Japan in 1963 after this category, the multilayer of various conception plans, manufacturing methods, in the world gradually throughout. As a result of the transistor into the era of integrated circuits, the use of computers gradually after the general, due to the need for high functionality, making the wiring capacity, transmission characteristics become a multi-layer board demands.

          The first multi-layer plate to the gap method (Clearance Hole) method, by layer method (Build Up) method, plating method (PTH) method three manufacturing methods are exposed. Because the void hole method is very laborious in manufacturing, and high density is limited, it is not practical. But because of the high density of the need for high density is not as urgent as ever, has been obscure; Seoul is due to the need for high-density circuit board Yiyin, again Into the various manufacturers R & D points. As for the double-panel process as the PTH method, is still the multilayer manufacturing process.

             Multilayer board manufacturing methods generally by the inner layer of the first to do, and then printed etching method to make single or double-sided substrate, and into the specified layer, and then by heating, pressure and be bonded, as for the future Drilling is the same as the double-sided plated hole. These basic manufacturing methods did not change much from the 1960s. However, with the material and process skills (for example, the bonding of bonding skills to solve the drilling of rubber residue, film improvement) more sophisticated, attached to The characteristics of the multilayer board are more diverse.

            YUSH Electronic Technology Co., Ltd produce Multi - layer circuit board cutting machine,Automation in pcb cutting process,PCB blade singulation 。


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                                  Multi - layer circuit board cutting machine information


                                  Multi - layer circuit board cutting machine information

                                  In 1961, the United States Hazelting Corp. announced that Multiplanar, is the first to open the development of multi-layer board precursor, this approach and now using plating through the hole to create multi-layer approach is almost the same. Japan in 1963 after this category, the multilayer of various conception plans, manufacturing methods, in the world gradually throughout. As a result of the transistor into the era of integrated circuits, the use of computers gradually after the general, due to the need for high functionality, making the wiring capacity, transmission characteristics become a multi-layer board demands.
                                  The first multi-layer plate to the gap method (Clearance Hole) method, by layer method (Build Up) method, plating method (PTH) method three manufacturing methods are exposed. Because the void hole method is very laborious in manufacturing, and high density is limited, it is not practical. But because of the high density of the need for high density is not as urgent as ever, has been obscure; Seoul is due to the need for high-density circuit board Yiyin, again Into the various manufacturers R & D points. As for the double-panel process as the PTH method, is still the multilayer manufacturing process.

                                     Multilayer board manufacturing methods generally by the inner layer of the first to do, and then printed etching method to make single or double-sided substrate, and into the specified layer, and then by heating, pressure and be bonded, as for the future Drilling is the same as the double-sided plated hole. These basic manufacturing methods did not change much from the 1960s. However, with the material and process skills (for example, the bonding of bonding skills to solve the drilling of rubber residue, film improvement) more sophisticated, attached to The characteristics of the multilayer board are more diverse.

                                    YUSH Electronic Technology Co., Ltd produce Multi - layer circuit board cutting machine,Automation in pcb cutting process,PCB blade singulation 。


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                                  99re8热视频这在线视频

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