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Specifications
| Model | YS-8160 |
| Machine dimension | 1300mm*850mm*2100mm(L*W*H) |
| Spraying chamber dimension | 870mm(L)×152mm(W) ×870mm(H) |
| Max Stencil size | 736mm*736mm*40mm(L*W*H) |
| Min Stencil size | 550mm*500mm*30mm(L*W*H) |
| Clean solvent | Aqueous clean solvent +DI Water |
| Ultrasonic Power | 1.8KW |
| Ulrasonic Frequency | 40KHZ |
| Water pump pressure | 0.2~0.3Mpa |
| Tank Volume | 30L |
| Heating Power | 4 KW |
| Woork temperature | Room temperature~60℃ |
| Fans Power | 3KW |
| Voltage | 380V AC/50HZ |
| Power | 10KW |
| Weight | 400KG |
YUSHUNLI Ultrasonic Stencil Cleaning Machine forPCB production line,Touch Ultrasonic combinate with high pressure spraying stencil clean machine
Cleaning Application
Apply to cleaning High precision small hole stencils, remove solder paste , flux and other residue .
Features :
Patent design, Touch ultrasonic combining with spray cleaning, the stencil is no need to dip into the tank
The stencil moves up and down with a gap 0.5-2 mm between the ultrasonic source with the cleaning agent fl ows by
High pressure air knives blowing the stencil closely during the lift makes the drying time very short
Efficiently clean fine printing pitch and apertures with the solder paste and glue
The cycle time is less than 10 min for the solder paste and 15 min for remove glue
PLC control, two modes, simple operation with buttons, safe and reliable, easy maintenance
MPC technology with fi ltration system, low running cost and environment-friendly
Specifications
| Model | YS-8160 |
| Machine dimension | 1300mm*850mm*2100mm(L*W*H) |
| Spraying chamber dimension | 870mm(L)×152mm(W) ×870mm(H) |
| Max Stencil size | 736mm*736mm*40mm(L*W*H) |
| Min Stencil size | 550mm*500mm*30mm(L*W*H) |
| Clean solvent | Aqueous clean solvent +DI Water |
| Ultrasonic Power | 1.8KW |
| Ulrasonic Frequency | 40KHZ |
| Water pump pressure | 0.2~0.3Mpa |
| Tank Volume | 30L |
| Heating Power | 4 KW |
| Woork temperature | Room temperature~60℃ |
| Fans Power | 3KW |
| Voltage | 380V AC/50HZ |
| Power | 10KW |
| Weight | 400KG |
YUSHUNLI Ultrasonic Stencil Cleaning Machine forPCB production line,Touch Ultrasonic combinate with high pressure spraying stencil clean machine
Cleaning Application
Apply to cleaning High precision small hole stencils, remove solder paste , flux and other residue .
Features :
Patent design, Touch ultrasonic combining with spray cleaning, the stencil is no need to dip into the tank
The stencil moves up and down with a gap 0.5-2 mm between the ultrasonic source with the cleaning agent fl ows by
High pressure air knives blowing the stencil closely during the lift makes the drying time very short
Efficiently clean fine printing pitch and apertures with the solder paste and glue
The cycle time is less than 10 min for the solder paste and 15 min for remove glue
PLC control, two modes, simple operation with buttons, safe and reliable, easy maintenance
MPC technology with fi ltration system, low running cost and environment-friendly
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